Journals similar to The International journal of microcircuits and electronic packaging
20 similar journals ranked by semantic similarity (SPECTER2 embeddings)
| # | Journal | Publisher | Field | Similarity | JLCS | OA | APC |
|---|---|---|---|---|---|---|---|
| 1 | Journal of Microelectronics and Electronic Packaging | IMAPS - International Microelectronics Assembly and Packaging Society | Electrical & Electronic Engineering | 99.7% | 55 | Yes (hybrid) | Free |
| 2 | IEEE Transactions on Components and Packaging Technologies | Institute of Electrical and Electronics Engineers | Mechanical Engineering | 99.5% | 55 | No | - |
| 3 | IMAPSource Proceedings | IMAPS - International Microelectronics Assembly and Packaging Society | Electrical & Electronic Engineering | 99.5% | 55 | No | - |
| 4 | Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) | IMAPS - International Microelectronics Assembly and Packaging Society | Electrical & Electronic Engineering | 99.4% | 55 | No | - |
| 5 | IEEE Transactions on Advanced Packaging | Institute of Electrical and Electronics Engineers | Physics | 99.3% | 55 | No | - |
| 6 | Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology | - | Electrical & Electronic Engineering | 99.3% | 15 | No | - |
| 7 | IEEE/CPMT International Electronics Manufacturing Technology Symposium | - | Geriatrics & Gerontology | 99.3% | 35 | No | - |
| 8 | IEEE Transactions on Components Packaging and Manufacturing Technology | Institute of Electrical and Electronics Engineers | Telecommunications & Networking | 99.3% | 75 | No | - |
| 9 | International Symposium on Microelectronics | IMAPS - International Microelectronics Assembly and Packaging Society | Physics | 99.2% | 55 | No | - |
| 10 | Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology | - | Mechanical Engineering | 99.2% | 15 | No | - |
| 11 | IEEE Transactions on Electronics Packaging Manufacturing | Institute of Electrical and Electronics Engineers | Electrical & Electronic Engineering | 99.2% | 55 | No | - |
| 12 | Journal of Electronic Packaging | ASME International | Mechanical Engineering | 99.1% | 75 | No | - |
| 13 | Transactions of The Japan Institute of Electronics Packaging | Japan Institute of Electronics Packaging | Mechanical Engineering | 99.0% | 55 | Yes (hybrid) | Free |
| 14 | Journal of Surface Mount Technology | Surface Mount Technology Association | Materials Science & Engineering (incl. Polymers, Textiles) | 98.8% | 55 | Yes (hybrid) | Free |
| 15 | I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems | - | Mechanical Engineering | 98.7% | 35 | No | - |
| 16 | Microelectronics International | Emerald (MCB UP) | Computer Engineering & Hardware | 98.7% | 75 | No | - |
| 17 | Circuit World | Emerald (MCB UP) | Environmental Engineering | 98.6% | 75 | No | - |
| 18 | Journal of The Japan Institute of Electronics Packaging | Japan Institute of Electronics Packaging | Physics | 98.4% | 55 | No | - |
| 19 | Journal of the Microelectronics and Packaging Society | - | Energy & Fuels | 98.4% | 55 | Yes (hybrid) | Free |
| 20 | Microelectronics Reliability | Elsevier | Computer Engineering & Hardware | 98.3% | 75 | No | 2190 USD |
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