Journals similar to I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
20 similar journals ranked by semantic similarity (SPECTER2 embeddings)
| # | Journal | Publisher | Field | Similarity | JLCS | OA | APC |
|---|---|---|---|---|---|---|---|
| 1 | Journal of Electronic Packaging | ASME International | Electrical and Electronic Engineering | 99.7% | 75 | No | - |
| 2 | Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology | - | Electrical and Electronic Engineering | 99.6% | 15 | No | - |
| 3 | Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings | - | Electrical and Electronic Engineering | 99.6% | 35 | No | - |
| 4 | IEEE Transactions on Components and Packaging Technologies | Institute of Electrical and Electronics Engineers | Electrical and Electronic Engineering | 99.5% | 55 | No | - |
| 5 | Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology | - | Electrical and Electronic Engineering | 99.0% | 15 | No | - |
| 6 | Journal of Microelectronics and Electronic Packaging | IMAPS - International Microelectronics Assembly and Packaging Society | Electrical and Electronic Engineering | 99.0% | 55 | Yes (hybrid) | Free |
| 7 | The International journal of microcircuits and electronic packaging | - | Electrical and Electronic Engineering | 98.7% | 35 | No | - |
| 8 | Journal of Electronics Cooling and Thermal Control | Scientific Research Publishing, Inc. | Mechanical Engineering | 98.7% | 55 | Yes (hybrid) | Free |
| 9 | IEEE Transactions on Components Packaging and Manufacturing Technology | Institute of Electrical and Electronics Engineers | Electrical and Electronic Engineering | 98.6% | 75 | No | - |
| 10 | Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) | IMAPS - International Microelectronics Assembly and Packaging Society | Electrical and Electronic Engineering | 98.5% | 55 | No | - |
| 11 | Transactions of The Japan Institute of Electronics Packaging | Japan Institute of Electronics Packaging | Electrical and Electronic Engineering | 98.5% | 55 | Yes (hybrid) | Free |
| 12 | IEEE Transactions on Electronics Packaging Manufacturing | Institute of Electrical and Electronics Engineers | Electrical and Electronic Engineering | 98.4% | 55 | No | - |
| 13 | IMAPSource Proceedings | IMAPS - International Microelectronics Assembly and Packaging Society | Electrical and Electronic Engineering | 98.4% | 55 | No | - |
| 14 | IEEE/CPMT International Electronics Manufacturing Technology Symposium | - | Electrical and Electronic Engineering | 98.3% | 35 | No | - |
| 15 | Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B | - | Biomedical Engineering | 98.3% | 15 | No | - |
| 16 | Microelectronics International | Emerald (MCB UP) | Electrical and Electronic Engineering | 98.2% | 75 | No | - |
| 17 | Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration | - | Mechanical Engineering | 98.2% | 15 | No | - |
| 18 | Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment | - | Mechanical Engineering | 98.1% | 15 | No | - |
| 19 | International Journal of Thermal Sciences | Elsevier | Computational Mechanics | 98.1% | 75 | No | 3660 USD |
| 20 | IEEE Transactions on Advanced Packaging | Institute of Electrical and Electronics Engineers | Electrical and Electronic Engineering | 98.1% | 55 | No | - |
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