Journals similar to Soldering and Surface Mount Technology
20 similar journals ranked by semantic similarity (SPECTER2 embeddings)
| # | Journal | Publisher | Field | Similarity | JLCS | OA | APC |
|---|---|---|---|---|---|---|---|
| 1 | Journal of Surface Mount Technology | Surface Mount Technology Association | Electrical and Electronic Engineering | 99.2% | 55 | Yes (hybrid) | Free |
| 2 | IEEE Transactions on Electronics Packaging Manufacturing | Institute of Electrical and Electronics Engineers | Electrical and Electronic Engineering | 99.1% | 55 | No | - |
| 3 | Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology | - | Electrical and Electronic Engineering | 99.0% | 15 | No | - |
| 4 | IEEE Transactions on Components and Packaging Technologies | Institute of Electrical and Electronics Engineers | Electrical and Electronic Engineering | 98.9% | 55 | No | - |
| 5 | Journal of Electronic Packaging | ASME International | Electrical and Electronic Engineering | 98.9% | 75 | No | - |
| 6 | Journal of the Microelectronics and Packaging Society | - | Electrical and Electronic Engineering | 98.7% | 55 | Yes (hybrid) | Free |
| 7 | IEEE/CPMT International Electronics Manufacturing Technology Symposium | Institute of Electrical and Electronics Engineers | Electrical and Electronic Engineering | 98.7% | 35 | No | - |
| 8 | Transactions of The Japan Institute of Electronics Packaging | Japan Institute of Electronics Packaging | Electrical and Electronic Engineering | 98.7% | 55 | Yes (hybrid) | Free |
| 9 | Journal of Microelectronics and Electronic Packaging | IMAPS - International Microelectronics Assembly and Packaging Society | Electrical and Electronic Engineering | 98.6% | 55 | Yes (hybrid) | Free |
| 10 | Journal of The Japan Institute of Electronics Packaging | Japan Institute of Electronics Packaging | Electrical and Electronic Engineering | 98.5% | 55 | No | - |
| 11 | Circuit World | Emerald (MCB UP) | Electrical and Electronic Engineering | 98.5% | 75 | No | - |
| 12 | Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology | - | Electrical and Electronic Engineering | 98.4% | 15 | No | - |
| 13 | International Symposium on Microelectronics | IMAPS - International Microelectronics Assembly and Packaging Society | Electrical and Electronic Engineering | 98.4% | 55 | No | - |
| 14 | Microelectronics International | Emerald (MCB UP) | Electrical and Electronic Engineering | 98.4% | 75 | No | - |
| 15 | IMAPSource Proceedings | IMAPS - International Microelectronics Assembly and Packaging Society | Electrical and Electronic Engineering | 98.3% | 55 | No | - |
| 16 | Journal of Smart Processing | Sumart Processing Society for Materials, Environment and Energy | Mechanical Engineering | 98.3% | 55 | Yes (hybrid) | Free |
| 17 | The International Journal of Microcircuits and Electronic Packaging | - | Electrical and Electronic Engineering | 98.2% | 35 | No | - |
| 18 | Electronics Process Technology | Springer Nature | Control and Systems Engineering | 98.1% | 15 | No | - |
| 19 | Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) | IMAPS - International Microelectronics Assembly and Packaging Society | Electrical and Electronic Engineering | 98.1% | 55 | No | - |
| 20 | 마이크로전자 및 패키징 학회지 | - | Electrical and Electronic Engineering | 98.1% | 15 | No | - |
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