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20 similar journals ranked by semantic similarity (SPECTER2 embeddings)

#JournalPublisherFieldSimilarityJLCSOAAPC
1 IEEE Transactions on Electronics Packaging Manufacturing Institute of Electrical and Electronics Engineers Electrical and Electronic Engineering 99.0% 55 No -
2 IEEE Transactions on Components and Packaging Technologies Institute of Electrical and Electronics Engineers Electrical and Electronic Engineering 98.5% 55 No -
3 Circuit World Emerald (MCB UP) Electrical and Electronic Engineering 98.4% 75 No -
4 Journal of Electronic Packaging ASME International Electrical and Electronic Engineering 98.3% 75 No -
5 Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Electrical and Electronic Engineering 98.2% 15 No -
6 Journal of Microelectronics and Electronic Packaging IMAPS - International Microelectronics Assembly and Packaging Society Electrical and Electronic Engineering 98.1% 55 Yes (hybrid) Free
7 The International Journal of Microcircuits and Electronic Packaging - Electrical and Electronic Engineering 98.1% 35 No -
8 IEEE/CPMT International Electronics Manufacturing Technology Symposium Institute of Electrical and Electronics Engineers Electrical and Electronic Engineering 98.1% 35 No -
9 Journal of Surface Mount Technology Surface Mount Technology Association Electrical and Electronic Engineering 98.1% 55 Yes (hybrid) Free
10 Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology - Electrical and Electronic Engineering 98.0% 15 No -
11 I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems Institute of Electrical and Electronics Engineers Electrical and Electronic Engineering 97.9% 35 No -
12 IMAPSource Proceedings IMAPS - International Microelectronics Assembly and Packaging Society Electrical and Electronic Engineering 97.9% 55 No -
13 International Symposium on Microelectronics IMAPS - International Microelectronics Assembly and Packaging Society Electrical and Electronic Engineering 97.9% 55 No -
14 Procedia CIRP Elsevier Industrial and Manufacturing Engineering 97.8% 55 Yes (hybrid) Free
15 Volume 2: Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability - Industrial and Manufacturing Engineering 97.8% 15 No -
16 Journal of Advanced Manufacturing Systems World Scientific Industrial and Manufacturing Engineering 97.8% 55 No -
17 Transactions of The Japan Institute of Electronics Packaging Japan Institute of Electronics Packaging Electrical and Electronic Engineering 97.8% 55 Yes (hybrid) Free
18 Soldering and Surface Mount Technology Emerald (MCB UP) Electrical and Electronic Engineering 97.8% 75 No -
19 IEEE Transactions on Components Packaging and Manufacturing Technology Institute of Electrical and Electronics Engineers Electrical and Electronic Engineering 97.7% 75 No -
20 Printed Circuit Information - Electrical and Electronic Engineering 97.7% 15 No -

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